Wednesday, January 15, 2025
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Samsung, LG to unveil new AI-powered appliances at IFA 2024

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Shillong, August 25:  South Korean tech giants Samsung Electronics and LG Electronics are planning to showcase various new artificial intelligence (AI)-powered home appliances at the IFA 2024 home electronics show in Berlin next month, industry sources said on Sunday.

 

Samsung will present a range of products, including the Bespoke AI Combo, an all-in-one washer-dryer; the Bespoke AI Family Hub, a premium refrigerator product; and the Bespoke AI Steam, a new robot vacuum cleaner product, reports Yonhap news agency.

 

The company will also showcase the strength of its AI-powered televisions. The Generative Wallpaper feature in Samsung televisions will recommend background images based on users’ preferences.

 

LG will unveil a new AI-powered drum washing machine with a reduced width of 25 inches, which is designed to meet the needs of European consumers.

 

The washer features the AI Direct Drive motor, which analyzes the weight, wetness and fabric of the laundry to determine the optimal washing method in order to protect garments.

 

The company will also showcase the newly launched LG Roboking AI All-in-One robot vacuum and the CordZero A9X All-in-One Tower Combo at the Berlin trade show.

 

Senior officials from the companies, including Han Jong-hee, vice chairman and head of Samsung’s device experience division, and LG Electronics CEO Cho Joo-wan are known to be planning to attend the event.

 

Meanwhile, Samsung has started mass production of the industry’s thinnest mobile DRAM tailored to on-device artificial intelligence (AI). The new chip, stacking four layers of 12nm-DRAM die, is 9 per cent thinner and 21.2 per cent more efficient in heat resistance compared to its predecessor.

 

The company said the ultra-slim LPDDR5X DRAM packages can create additional space within mobile devices, enabling high-performance applications and advanced features like on-device AI.

 

Samsung has also set up a unit dedicated to developing high bandwidth memory (HBM) in a bid to regain the leadership in the AI semiconductor market. (IANS)

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