Sunday, May 19, 2024
spot_img

Session on semiconductor fabrication and packaging projects

Date:

Share post:

spot_img
spot_img

 

Guwahati, April 5: A session on “Semiconductor Fabrication and Packaging Projects: A Giant Leap for India” was organized today by the Department of Engineering & Technology, USTM under the banner of Viksit Bharat Programme.

The session began with a welcome speech by Dr P K Pathak, Head of the Department,
Department of Engineering & Technology, USTM followed by a speech of Prof G D Sharma,
Vice Chancellor, USTM.

Prof Manabendra Bhuyan, Retd Pro VC, Tezpur University, was the keynote speaker of the
session. In his speech he elaborated about the importance of Semiconductor Industry in India and how students can build their career in this area.

The brainstorming session was attended by nearly 100 students from the Department of
Engineering & Technology, USTM and Department of Electrical and Electronic Engineering,
Regional Institute of Science and Technology (RIST). The session concluded with a vote of
thanks by Karjan Basumatary, Registrar RIST.

 

spot_img
spot_img

Related articles

WhatsApp working on several new features to enhance user experience

Shillong, May 19: Meta-owned WhatsApp is reportedly working on several new features to enhance the user experience on...

Shruti Haasan offers a peek into her Sunday: ‘Over-sleeping, self-love and biriyani’

Shillong, May 19: Actress Shruti Haasan has talked about what Sunday according to her is for. Shruti on Sunday...

‘Above normal’ monsoon prediction put these stocks in top gear

Shillong, May 19: The Indian Metrology Department has predicted an 'above normal' monsoon for 2024. A good monsoon always...

Musk meets Sri Lankan President in Indonesia, discusses Starlink implementation

Shillong, May 19: Tesla and SpaceX CEO Elon Musk on Sunday met Sri Lankan President Ranil Wickremesinghe in...